IC packaging and testing firms to see April growth
Friday 20 March 2009]
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and King Yuan Electronics Company (KYEC) will see better-than-expected performances in April amid increasing orders from the telecom, consumer electronics and PC segments, according to market watchers.
Utilization rates at the IC packaging and testing houses will climb to 60% in April, with order visibility already extending to the middle of next month, the watchers said.
Telecom chip vendors Altera, MediaTek and Qualcomm have recently increased their orders to backend service providers, buoyed by rising demand in the China market, said the watchers. Qualcomm, which recently secured new chip orders for China Telecom-distributed handsets, has tripled the volume of orders in March compared to that in January.
China's rising demand for LCD TVs on the government's stimulus program will also play a part in the backend service providers' revenue growth and improved utilization in April, the watchers noted.
ASE and SPIL have seen AMD and Nvidia resume orders for entry-level and mid-range products, the watchers indicated. The two packaging firms are also expected to gain a substantial amount of ball grid array (BGA) packaging orders for Intel's southbridge chips after the chip giant shut down its Luzon plant in the Philippines, the watchers said.
ASE said it remains cautious about the market, as order visibility has yet to extende to May of June. The world's largest packaging firm said that the current rebound in the market has been mainly contributed by demand in China.
It said if end-market demand in Europe and the US does not pick up, the semiconductor sector may see orders decline again in May or June.
Friday 20 March 2009]
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and King Yuan Electronics Company (KYEC) will see better-than-expected performances in April amid increasing orders from the telecom, consumer electronics and PC segments, according to market watchers.
Utilization rates at the IC packaging and testing houses will climb to 60% in April, with order visibility already extending to the middle of next month, the watchers said.
Telecom chip vendors Altera, MediaTek and Qualcomm have recently increased their orders to backend service providers, buoyed by rising demand in the China market, said the watchers. Qualcomm, which recently secured new chip orders for China Telecom-distributed handsets, has tripled the volume of orders in March compared to that in January.
China's rising demand for LCD TVs on the government's stimulus program will also play a part in the backend service providers' revenue growth and improved utilization in April, the watchers noted.
ASE and SPIL have seen AMD and Nvidia resume orders for entry-level and mid-range products, the watchers indicated. The two packaging firms are also expected to gain a substantial amount of ball grid array (BGA) packaging orders for Intel's southbridge chips after the chip giant shut down its Luzon plant in the Philippines, the watchers said.
ASE said it remains cautious about the market, as order visibility has yet to extende to May of June. The world's largest packaging firm said that the current rebound in the market has been mainly contributed by demand in China.
It said if end-market demand in Europe and the US does not pick up, the semiconductor sector may see orders decline again in May or June.
22/3 2009 22:02 le 0
5350 Holtek sees leap in MCU shipments
Friday 20 March 2009]
Microcontroller (MCU) maker Holtek Semiconductor has already shipped over 100 million MCUs this month mostly from short lead time orders. Investors expect Holtek's revenues in March to reach NT$200 million (US$5.94 million), representing a 10-20% sequential growth.
Holtek's consolidated revenues in February increased 30% to NT$185 million. MCU shipments in January and February totaled 50 million and 80 million, respectively.
The company expects to receive home appliance MCU orders amid demand from China government's stimulus program.
In terms of consumer IC product lines, Holtek said it is in talks with toy companies in North America and Australia for its voice and gaming related MCUs.
Holtek's shipments of LED touch controllers are targeting home appliances and medical electronics segments and the company is also planning to enter the notebook and netbook markets.
Holtek Semiconductor's MCU product for washing machines
Photo: Terry Ku, Digitimes, March 2009
Friday 20 March 2009]
Microcontroller (MCU) maker Holtek Semiconductor has already shipped over 100 million MCUs this month mostly from short lead time orders. Investors expect Holtek's revenues in March to reach NT$200 million (US$5.94 million), representing a 10-20% sequential growth.
Holtek's consolidated revenues in February increased 30% to NT$185 million. MCU shipments in January and February totaled 50 million and 80 million, respectively.
The company expects to receive home appliance MCU orders amid demand from China government's stimulus program.
In terms of consumer IC product lines, Holtek said it is in talks with toy companies in North America and Australia for its voice and gaming related MCUs.
Holtek's shipments of LED touch controllers are targeting home appliances and medical electronics segments and the company is also planning to enter the notebook and netbook markets.
Holtek Semiconductor's MCU product for washing machines
Photo: Terry Ku, Digitimes, March 2009
22/3 2009 22:08 le 05351 Kinsus expects strong substrate shipment growth in March due to China 3G deployment
Friday 20 March 2009]
IC substrate maker Kinsus Interconnect Technology estimates that March revenues will top NT$700 million (US$20.74 million) because China handset makers have expanded deployment of 3G base stations, driving demand for bismaleimide triazine-based flip-chip (FC) and FC chip-scale packaging (CSP) substrates, according to the company.
Kinsus' order visibility has extended to mid-April, and revenues in April is expected to be flat, said the company.
Orders for handset chip substrates from Qualcomm have also driven Kinsus' shipments of FC CSPs, according to market sources.
The company's February revenues totaled NT$521 million, the company said. Utilization rate in January and February was 45% and 50% respectively, and March utilization may increase to 65-70%, the company added.
Kinsus, Japan-based Ibiden and Korea-based Semco account for 80% of the FC CSP market. Other Taiwan IC substrate companies including Phoenix Precision Technology (PPT), Unimicron Technology and Nan Ya Printed Circuit Board (NPC) are also aggressively cutting into the market, according to the market sources.
Friday 20 March 2009]
IC substrate maker Kinsus Interconnect Technology estimates that March revenues will top NT$700 million (US$20.74 million) because China handset makers have expanded deployment of 3G base stations, driving demand for bismaleimide triazine-based flip-chip (FC) and FC chip-scale packaging (CSP) substrates, according to the company.
Kinsus' order visibility has extended to mid-April, and revenues in April is expected to be flat, said the company.
Orders for handset chip substrates from Qualcomm have also driven Kinsus' shipments of FC CSPs, according to market sources.
The company's February revenues totaled NT$521 million, the company said. Utilization rate in January and February was 45% and 50% respectively, and March utilization may increase to 65-70%, the company added.
Kinsus, Japan-based Ibiden and Korea-based Semco account for 80% of the FC CSP market. Other Taiwan IC substrate companies including Phoenix Precision Technology (PPT), Unimicron Technology and Nan Ya Printed Circuit Board (NPC) are also aggressively cutting into the market, according to the market sources.
22/3 2009 22:11 le 05353 MLCC prices stabilizing
Friday 20 March 2009]
The decline of multi-layer ceramic-chip capacitor (MLCC) prices is slowing down thanks to capacity reductions from Japan. Taiwan MLCC companies believed margins bottomed out in fourth-quarter 2008, according to market watchers.
Taiwan MLCC makers all have seen an over 20% revenue growth in February and are expected to see revenues and utilization rates in March continue to increase. However, companies are still likely to see a 10-15% sequential decline in the first quarter.
Friday 20 March 2009]
The decline of multi-layer ceramic-chip capacitor (MLCC) prices is slowing down thanks to capacity reductions from Japan. Taiwan MLCC companies believed margins bottomed out in fourth-quarter 2008, according to market watchers.
Taiwan MLCC makers all have seen an over 20% revenue growth in February and are expected to see revenues and utilization rates in March continue to increase. However, companies are still likely to see a 10-15% sequential decline in the first quarter.
22/3 2009 22:13 le 05354 DRAM and NAND flash spot prices show mild rebound, says inSpectrum
Friday 20 March 2009]
Prices for DRAM chips have trended upward by around 2.6% during the week of March 16-20, while NAND flash prices have grown up to 0.88%, according to inSpectrum.
Quotes for mainstream 1Gb DDR2 remain above the US$0.75 level, said inSpectrum. Hynix Semiconductor's move to reduce supply has helped driven up the prices.
Despite the recent rally in the DRAM spot market, inSpectrum said that the price of mainstream 1Gb DDR2 still lacks the momentum to break US$0.8, as most buyers are reluctant to buy when prices approach the level.
In the NAND flash spot market, supply of Samsung Electronics chips has been tight, inSpectrum cited distributors and agents as saying.
Spot price for mainstream 1Gb DDR2 chips, March 16-20 (US$)
Branded
Unbranded
2009/03/13
0.77
0.76
2009/03/16
0.78
0.79
2009/03/17
0.79
0.8
2009/03/18
0.79
0.79
2009/03/19
0.79
0.78
2009/03/20
0.79
0.78
Source: inSpectrum, compiled by Digitimes, March 2009
Spot price for mainstream MLC NAND flash, March 16-20 (US$)
16Gb
32Gb
2009/03/13
3.41
5.81
2009/03/16
3.47
5.8
2009/03/17
3.48
5.86
2009/03/18
3.47
5.86
2009/03/19
3.43
5.81
2009/03/20
3.43
5.81
Source: inSpectrum, compiled by Digitimes, March 2009
Friday 20 March 2009]
Prices for DRAM chips have trended upward by around 2.6% during the week of March 16-20, while NAND flash prices have grown up to 0.88%, according to inSpectrum.
Quotes for mainstream 1Gb DDR2 remain above the US$0.75 level, said inSpectrum. Hynix Semiconductor's move to reduce supply has helped driven up the prices.
Despite the recent rally in the DRAM spot market, inSpectrum said that the price of mainstream 1Gb DDR2 still lacks the momentum to break US$0.8, as most buyers are reluctant to buy when prices approach the level.
In the NAND flash spot market, supply of Samsung Electronics chips has been tight, inSpectrum cited distributors and agents as saying.
Spot price for mainstream 1Gb DDR2 chips, March 16-20 (US$)
Branded
Unbranded
2009/03/13
0.77
0.76
2009/03/16
0.78
0.79
2009/03/17
0.79
0.8
2009/03/18
0.79
0.79
2009/03/19
0.79
0.78
2009/03/20
0.79
0.78
Source: inSpectrum, compiled by Digitimes, March 2009
Spot price for mainstream MLC NAND flash, March 16-20 (US$)
16Gb
32Gb
2009/03/13
3.41
5.81
2009/03/16
3.47
5.8
2009/03/17
3.48
5.86
2009/03/18
3.47
5.86
2009/03/19
3.43
5.81
2009/03/20
3.43
5.81
Source: inSpectrum, compiled by Digitimes, March 2009
22/3 2009 22:16 le 05355 TSMC and UMC see rising orders for AMD GPUs for 2Q09, says paper
Thursday 19 March 2009]
Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) have landed combined orders of 30,000 wafers (12-inch equivalent) for new AMD graphics processors, which are slated to launch by the second quarter of 2009, the Chinese-language Commercial Times has reported.
AMD's upcoming GPUs include the 55nm-based RV790 and 40nm RV740. The two chips are expected to be launched in April.
According to the paper, AMD ordered less than 2,000 wafers for January and February, but the volume has doubled to 4,000-5,000 units this month. The graphics chip vendor is expected to place orders of 8,000-9,000 wafers with its Taiwan-based contract chipmakers for April, and the volume will climb to 10,000 units in May and June.
The paper also indicated that TSMC and UMC have brought back all employees to their 12-inch production lines, as well as further shortening compulsory unpaid leave.
TSMC and UMC's 12-inch fabs will likely reach 60-70% utilization in the second quarter of 2009, market watchers have estimated. The two pure-play foundries reportedly have recently seen their utilization rates rise to 50-60%.
TSMC, UMC: February 2008 - February 2009 revenues (NT$m)
Month
UMC
TSMC
Sales
Y/Y
Sales
Y/Y
Feb-09
3,144
(56.9%)
11,504
(59.5%)
Jan-09
3,153
(61.6%)
12,436
(58.9%)
Dec-08
4,610
(45.5%)
13,161
(54.8%)
Nov-08
6,025
(33.3%)
19,295
(36%)
Oct-08
7,907
(21.9%)
28,371
(10.6%)
Sep-08
8,052
(23.6%)
28,252
(1.4%)
Aug-08
8,165
(21.7%)
30,995
6.2%
Jul-08
8,537
(15.1%)
30,869
7.3%
Jun-08
8,105
(7.3%)
28,510
12.9%
May-08
8,607
4.7%
28,990
15.5%
Apr-08
8,521
4.8%
28,094
24.8%
Mar-08
8,498
12.6%
26,562
21.2%
Feb-08
7,289
0.7%
28,382
37.9%
*Figures are not consolidated
Source: TSE, compiled by Digitimes, March 2009
TSMC, UMC: 3Q 2007 - 3Q 2008 revenues (NT$m)
Quarter
UMC
TSMC
Sales
Y/Y
Sales
Y/Y
3Q-08
24,748
(20.2%)
90,117
4.2%
2Q-08
25,238
0.6%
85,594
17.5%
1Q-08
24,003
4.3%
85,230
34.6%
4Q-07
27,621
5.8%
90,989
23.1%
3Q-07
31,029
11.4%
86,461
6.2%
*Figures are not consolidated
Source: TSE, compiled by Digitimes, March 2009
Thursday 19 March 2009]
Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) have landed combined orders of 30,000 wafers (12-inch equivalent) for new AMD graphics processors, which are slated to launch by the second quarter of 2009, the Chinese-language Commercial Times has reported.
AMD's upcoming GPUs include the 55nm-based RV790 and 40nm RV740. The two chips are expected to be launched in April.
According to the paper, AMD ordered less than 2,000 wafers for January and February, but the volume has doubled to 4,000-5,000 units this month. The graphics chip vendor is expected to place orders of 8,000-9,000 wafers with its Taiwan-based contract chipmakers for April, and the volume will climb to 10,000 units in May and June.
The paper also indicated that TSMC and UMC have brought back all employees to their 12-inch production lines, as well as further shortening compulsory unpaid leave.
TSMC and UMC's 12-inch fabs will likely reach 60-70% utilization in the second quarter of 2009, market watchers have estimated. The two pure-play foundries reportedly have recently seen their utilization rates rise to 50-60%.
TSMC, UMC: February 2008 - February 2009 revenues (NT$m)
Month
UMC
TSMC
Sales
Y/Y
Sales
Y/Y
Feb-09
3,144
(56.9%)
11,504
(59.5%)
Jan-09
3,153
(61.6%)
12,436
(58.9%)
Dec-08
4,610
(45.5%)
13,161
(54.8%)
Nov-08
6,025
(33.3%)
19,295
(36%)
Oct-08
7,907
(21.9%)
28,371
(10.6%)
Sep-08
8,052
(23.6%)
28,252
(1.4%)
Aug-08
8,165
(21.7%)
30,995
6.2%
Jul-08
8,537
(15.1%)
30,869
7.3%
Jun-08
8,105
(7.3%)
28,510
12.9%
May-08
8,607
4.7%
28,990
15.5%
Apr-08
8,521
4.8%
28,094
24.8%
Mar-08
8,498
12.6%
26,562
21.2%
Feb-08
7,289
0.7%
28,382
37.9%
*Figures are not consolidated
Source: TSE, compiled by Digitimes, March 2009
TSMC, UMC: 3Q 2007 - 3Q 2008 revenues (NT$m)
Quarter
UMC
TSMC
Sales
Y/Y
Sales
Y/Y
3Q-08
24,748
(20.2%)
90,117
4.2%
2Q-08
25,238
0.6%
85,594
17.5%
1Q-08
24,003
4.3%
85,230
34.6%
4Q-07
27,621
5.8%
90,989
23.1%
3Q-07
31,029
11.4%
86,461
6.2%
*Figures are not consolidated
Source: TSE, compiled by Digitimes, March 2009
22/3 2009 22:19 le 05356 Driver IC makers expect new orders to continue in 2Q09
Thursday 19 March 2009]
Driver IC design houses Orise Technology and Sitronix Technology have both said they believe the current uptick in orders will continue into the second quarter driven by demand for low-cost handsets in China and other emerging markets while market watchers predict the growth momentum may slow down.
Orise will begin handset driver IC shipments to a new client in the second quarter, and is expected to increase its market share.
Orise Tech and Sitronix: February 2008 - February 2009 revenues (NT$m)
Month
Orisetech
Sitronix
Sales
Y/Y
Sales
Y/Y
Feb-09
201
(48%)
341
(33.4%)
Jan-09
141
(58.5%)
191
(68.4%)
Dec-08
138
(66.3%)
253
(53.1%)
Nov-08
224
(44.5%)
422
(30%)
Oct-08
407
(1.1%)
606
(1.1%)
Sep-08
501
24.1%
619
6.4%
Aug-08
474
26.9%
631
18.4%
Jul-08
456
35.7%
588
16.7%
Jun-08
368
18.1%
507
6.9%
May-08
408
33.1%
552
30.3%
Apr-08
434
46.2%
558
46.1%
Mar-08
432
52.8%
552
52.8%
Feb-08
386
88.2%
512
85.9%
*Figures are not consolidated
Source: TSE, compiled by Digitimes, March 2009
Orise Tech and Sitronix: 3Q 2007 - 3Q 2008 revenues (NT$m)
Quarter
Orisetech
Sitronix
Sales
Y/Y
Sales
Y/Y
3Q-08
1,431
28.6%
1,838
13.6%
2Q-08
1,210
32.3%
1,617
26.3%
1Q-08
1,158
61.6%
1,666
66.8%
4Q-07
1,225
12.7%
1,756
52.7%
3Q-07
1,113
8.6%
1,619
36.9%
*Figures are not consolidated
Source: TSE, compiled by Digitimes, March 2009
Thursday 19 March 2009]
Driver IC design houses Orise Technology and Sitronix Technology have both said they believe the current uptick in orders will continue into the second quarter driven by demand for low-cost handsets in China and other emerging markets while market watchers predict the growth momentum may slow down.
Orise will begin handset driver IC shipments to a new client in the second quarter, and is expected to increase its market share.
Orise Tech and Sitronix: February 2008 - February 2009 revenues (NT$m)
Month
Orisetech
Sitronix
Sales
Y/Y
Sales
Y/Y
Feb-09
201
(48%)
341
(33.4%)
Jan-09
141
(58.5%)
191
(68.4%)
Dec-08
138
(66.3%)
253
(53.1%)
Nov-08
224
(44.5%)
422
(30%)
Oct-08
407
(1.1%)
606
(1.1%)
Sep-08
501
24.1%
619
6.4%
Aug-08
474
26.9%
631
18.4%
Jul-08
456
35.7%
588
16.7%
Jun-08
368
18.1%
507
6.9%
May-08
408
33.1%
552
30.3%
Apr-08
434
46.2%
558
46.1%
Mar-08
432
52.8%
552
52.8%
Feb-08
386
88.2%
512
85.9%
*Figures are not consolidated
Source: TSE, compiled by Digitimes, March 2009
Orise Tech and Sitronix: 3Q 2007 - 3Q 2008 revenues (NT$m)
Quarter
Orisetech
Sitronix
Sales
Y/Y
Sales
Y/Y
3Q-08
1,431
28.6%
1,838
13.6%
2Q-08
1,210
32.3%
1,617
26.3%
1Q-08
1,158
61.6%
1,666
66.8%
4Q-07
1,225
12.7%
1,756
52.7%
3Q-07
1,113
8.6%
1,619
36.9%
*Figures are not consolidated
Source: TSE, compiled by Digitimes, March 2009
22/3 2009 22:22 le 05357 Driver IC packaging firms see capacity utilization improve on China demand
Thursday 19 March 2009]
Driver IC packaging and testing companies Chipbond Technology, International Semiconductor Technology (IST) and King Yuan Electronics Company (KYEC) have seen their recently capacity utilization rates climb to 40-50%, compared to 30-40% before the Lunar New Year, according to company sources. Order visibility has also extended to between the middle of April and early May.
In line with improved utilization and order visibility, market watchers have estimated that the backend service suppliers will enjoy revenue growth of more than 20% sequentially in March, thanks to rising demand from the China market. The China government's subsidy program to boost domestic spending will continue to contribute to sequential revenue growth over the next month.
Chipbond estimated revenues for March will climb to NT$250-300 million (US$7.37-8.84 million), and said its order visibility has extended to the middle of April.
IST said that its utilization rate has risen to 60-70%. The company expects to manage revenue growths of 30-40% sequentially in March and April, and aims to return to profitability in the second half of the year.
Chipbond, IST and KYEC: February 2008 - February 2009 revenues (NT$m)
Month
KYEC
IST
Chipbond
Sales
Y/Y
Sales
Y/Y
Sales
Y/Y
Feb-09
432
(59.8%)
144
(60.9%)
212
(54%)
Jan-09
356
(69.9%)
102
(71.6%)
134
(75.9%)
Dec-08
458
(62.4%)
106
(68.1%)
167
(68.1%)
Nov-08
810
(35.8%)
193
(54.6%)
278
(46.2%)
Oct-08
1,050
(19.9%)
295
(46.3%)
437
(27.2%)
Sep-08
1,151
(11.6%)
379
(34.4%)
450
(21.1%)
Aug-08
1,206
(4.4%)
380
(38.1%)
420
(21.8%)
Jul-08
1,229
8.2%
523
(26.2%)
434
(15.7%)
Jun-08
1,222
15%
475
(27.2%)
504
0.5%
May-08
1,205
15.6%
464
(10.2%)
474
(3.3%)
Apr-08
1,201
16%
429
12.9%
542
32.9%
Mar-08
1,251
22%
464
4.3%
541
26.4%
Feb-08
1,072
17.8%
367
2.9%
462
36.7%
*Figures are not consolidated
Source: TSE, compiled by Digitimes, March 2009
Chipbond, IST and KYEC: 3Q 2007 - 3Q 2008 revenues (NT$m)
Quarter
KYEC
IST
Chipbond
Sales
Y/Y
Sales
Y/Y
Sales
Y/Y
3Q-08
3,585
(3.1%)
1,282
(32.2%)
1,304
(19.6%)
2Q-08
3,628
15.5%
1,367
(11.7%)
1,520
8.6%
1Q-08
3,503
18.9%
1,192
(4.4%)
1,557
30.2%
4Q-07
3,793
11.6%
1,307
(16.1%)
1,640
41.5%
3Q-07
3,700
12.8%
1,890
58.4%
1,622
71.4%
*Figures are not consolidated
Source: TSE, compiled by Digitimes, March 2009
Thursday 19 March 2009]
Driver IC packaging and testing companies Chipbond Technology, International Semiconductor Technology (IST) and King Yuan Electronics Company (KYEC) have seen their recently capacity utilization rates climb to 40-50%, compared to 30-40% before the Lunar New Year, according to company sources. Order visibility has also extended to between the middle of April and early May.
In line with improved utilization and order visibility, market watchers have estimated that the backend service suppliers will enjoy revenue growth of more than 20% sequentially in March, thanks to rising demand from the China market. The China government's subsidy program to boost domestic spending will continue to contribute to sequential revenue growth over the next month.
Chipbond estimated revenues for March will climb to NT$250-300 million (US$7.37-8.84 million), and said its order visibility has extended to the middle of April.
IST said that its utilization rate has risen to 60-70%. The company expects to manage revenue growths of 30-40% sequentially in March and April, and aims to return to profitability in the second half of the year.
Chipbond, IST and KYEC: February 2008 - February 2009 revenues (NT$m)
Month
KYEC
IST
Chipbond
Sales
Y/Y
Sales
Y/Y
Sales
Y/Y
Feb-09
432
(59.8%)
144
(60.9%)
212
(54%)
Jan-09
356
(69.9%)
102
(71.6%)
134
(75.9%)
Dec-08
458
(62.4%)
106
(68.1%)
167
(68.1%)
Nov-08
810
(35.8%)
193
(54.6%)
278
(46.2%)
Oct-08
1,050
(19.9%)
295
(46.3%)
437
(27.2%)
Sep-08
1,151
(11.6%)
379
(34.4%)
450
(21.1%)
Aug-08
1,206
(4.4%)
380
(38.1%)
420
(21.8%)
Jul-08
1,229
8.2%
523
(26.2%)
434
(15.7%)
Jun-08
1,222
15%
475
(27.2%)
504
0.5%
May-08
1,205
15.6%
464
(10.2%)
474
(3.3%)
Apr-08
1,201
16%
429
12.9%
542
32.9%
Mar-08
1,251
22%
464
4.3%
541
26.4%
Feb-08
1,072
17.8%
367
2.9%
462
36.7%
*Figures are not consolidated
Source: TSE, compiled by Digitimes, March 2009
Chipbond, IST and KYEC: 3Q 2007 - 3Q 2008 revenues (NT$m)
Quarter
KYEC
IST
Chipbond
Sales
Y/Y
Sales
Y/Y
Sales
Y/Y
3Q-08
3,585
(3.1%)
1,282
(32.2%)
1,304
(19.6%)
2Q-08
3,628
15.5%
1,367
(11.7%)
1,520
8.6%
1Q-08
3,503
18.9%
1,192
(4.4%)
1,557
30.2%
4Q-07
3,793
11.6%
1,307
(16.1%)
1,640
41.5%
3Q-07
3,700
12.8%
1,890
58.4%
1,622
71.4%
*Figures are not consolidated
Source: TSE, compiled by Digitimes, March 2009
22/3 2009 22:26 le 05358 MediaTek revenues expected to grow 20% in 2Q09
IC design | Mar 18, 11:20
MediaTek, which earlier this month lifted its first-quarter guidance, is expected to enjoy a revenue growth of 20% sequentially in the second quarter of 2009, with total revenues of NT$27-28 billion (US$792.49-821.84 million), according to market watchers. Read more
IC design | Mar 18, 11:20
MediaTek, which earlier this month lifted its first-quarter guidance, is expected to enjoy a revenue growth of 20% sequentially in the second quarter of 2009, with total revenues of NT$27-28 billion (US$792.49-821.84 million), according to market watchers. Read more
22/3 2009 22:31 le 05359 Texas Instruments (TI) may resume placing orders with its contract partners in Taiwan, including foundry service provider Taiwan Semiconductor Manufacturing...
22/3 2009 22:37 le 05360 The price of mainstream DDR2 1Gb eTT chips rose over 5% to close at US$0.84 on March 17, as a result of tight supply, according to quotes gathered by...
22/3 2009 22:48 le 05362 panels - igen et eksempel på den kraftige lagerreduktion, der stabiliserer efterspørgslen igen tilbage til det man forbruger - AUO is optimistic for 2009 outlook
Friday 20 March 2009]
LJ Chen, president and CEO of AU Optronics (AUO), has struck an optimistic note about the LCD panel market in 2009, saying the industry does not need to be pessimistic because of demand for large-size panels from North America and China.
He said industy players are likely to continue refraining from placing long-term orders throughout 2009 due to the uncertain economic outlook, and will rely on short-lead-time orders. But Chen said such short-term business will be good for the industry by keeping inventories low.
Chen noted that the company's utilization rate in the first quarter will be about 50-60%, in line with earlier expectations, and the company expects to see month-by-month growth in 2009.
As for the unpaid leave policy that AUO has implemented, Chen indicated that it will be adjusted according to the utilization rates. But he stressed the company's principle is to avoid inventory build-up.
Corning has also announced that it expects to see a better-than-expected performance in the first quarter as panel makers are increasing utilization rate amid rising demand in the North America and China markets. Corning expect its glass volume in the first quarter to remain flat to down 5%, increased from previous estimation of 20-25% decline.
Friday 20 March 2009]
LJ Chen, president and CEO of AU Optronics (AUO), has struck an optimistic note about the LCD panel market in 2009, saying the industry does not need to be pessimistic because of demand for large-size panels from North America and China.
He said industy players are likely to continue refraining from placing long-term orders throughout 2009 due to the uncertain economic outlook, and will rely on short-lead-time orders. But Chen said such short-term business will be good for the industry by keeping inventories low.
Chen noted that the company's utilization rate in the first quarter will be about 50-60%, in line with earlier expectations, and the company expects to see month-by-month growth in 2009.
As for the unpaid leave policy that AUO has implemented, Chen indicated that it will be adjusted according to the utilization rates. But he stressed the company's principle is to avoid inventory build-up.
Corning has also announced that it expects to see a better-than-expected performance in the first quarter as panel makers are increasing utilization rate amid rising demand in the North America and China markets. Corning expect its glass volume in the first quarter to remain flat to down 5%, increased from previous estimation of 20-25% decline.
